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| DOI | 10.1109/TIE.2012.2227903 | ||||
| Año | 2013 | ||||
| Tipo | artículo de investigación |
Citas Totales
Autores Afiliación Chile
Instituciones Chile
% Participación
Internacional
Autores
Afiliación Extranjera
Instituciones
Extranjeras
Three-level active neutral-point-clamped (NPC) (ANPC) (3L-ANPC) voltage-source converters (3L-ANPC VSCs) offer three additional switch states and an increase of commutations by a factor of four, compared to the three-level NPC voltage-source converter. This paper presents, for the first time, a detailed analysis of all 3L-ANPC VSC commutations using high-power 5SHY55L4500 integrated gate-commutated thyristors. Starting with a description of the switching states and commutations, a new 3-kV 5-kA medium-voltage 3L-ANPC testbench is described. To verify the function of all commutations, this paper derives suitable switching sequences and analyzes the commutations and switching transients in detail for dc-link voltages of 2.13-2.43 kV and load currents of 3.95-4.36 kA. The experimental investigations show that, although the ANPC commutations substantially differ from NPC commutations, the ANPC commutations do not present critical operating conditions for the power semiconductors or the converters. Thus, all 32 ANPC commutations can be applied in a new medium-voltage converter realization.
| Ord. | Autor | Género | Institución - País |
|---|---|---|---|
| 1 | ANDLER-OSORIO, DANIEL | Hombre |
Universidad Técnica Federico Santa María - Chile
Tech Univ Dresden - Alemania TECHNISCHE UNIVERSITAT DRESDEN - Alemania |
| 2 | Alvarez, Rodrigo | Hombre |
Tech Univ Dresden - Alemania
TECHNISCHE UNIVERSITAT DRESDEN - Alemania |
| 3 | Bernet, Steffen | Hombre |
Tech Univ Dresden - Alemania
TECHNISCHE UNIVERSITAT DRESDEN - Alemania |
| 4 | RODRIGUEZ-PEREZ, JOSE RAMON | Hombre |
Universidad Técnica Federico Santa María - Chile
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| Fuente |
|---|
| Universidad Técnica Federico Santa María |
| German Academic Exchange Service (DAAD) |
| Technische Universität Dresden |
| MECESUP program |
| Centro Cientifico-Tecnologico de Valparaiso |
| Agradecimiento |
|---|
| This work was supported in part by the Technische Universitat Dresden, in part by the Universidad Tecnica Federico Santa Maria, in part by Mecesup Program FSM0601, in part by the Centro Cientifico-Tecnologico de Valparaiso (fb0821) Project, and in part by the German Academic Exchange Service (DAAD). |