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| DOI | 10.1016/J.ENGSTRUCT.2014.07.006 | ||||
| Año | 2014 | ||||
| Tipo | artículo de investigación |
Citas Totales
Autores Afiliación Chile
Instituciones Chile
% Participación
Internacional
Autores
Afiliación Extranjera
Instituciones
Extranjeras
The behavior of a bi-directional energy dissipation device made of copper was investigated. The development considered four phases; (1) characterization and numerical modeling of the cyclic plastic behavior of Electrolytic Tough Pitch copper using the Chaboche constitutive model; (2) generation of a finite element model including large deformations and the inelastic constitutive model of the material; (3) numerical design of the device using the response surface methodology; and (4) design and testing of two different proof-of-concept devices subjected to both, a unidirectional and a bi-directional displacement load path. The cyclic response of the device showed significant energy dissipation capacity even for very small deformations. It was also capable of sustaining 20 large cycles prior to failure. The numerical model used was capable of representing the cyclic response characteristics of the damper very accurately, and the proposed design process was validated using the measured response of the tested devices. It is concluded that annealed copper is an interesting material for energy dissipation and that the design procedure developed proved to be cost-effective and applicable to other metallic dampers. (C) 2014 Elsevier Ltd. All rights reserved.
| Ord. | Autor | Género | Institución - País |
|---|---|---|---|
| 1 | Briones, Benjamin | Hombre |
Pontificia Universidad Católica de Chile - Chile
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| 2 | de la Llera Martin, Juan Carlos | Hombre |
Pontificia Universidad Católica de Chile - Chile
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| Fuente |
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| Fondo Nacional de Ciencia y Tecnología |
| International Copper Association |
| Fondo Nacional de Ciencia y TecnologÃa |
| International Copper Association (ICA) |
| Fondo de Financiamiento de Centros de Investigacion en Areas Prioritarias FONDAP CIGIDEN |
| Chilean Fondo Nacional de Ciencia y Tecnologia FONDECYT |
| Agradecimiento |
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| This research has been supported by the International Copper Association (ICA), and the Chilean Fondo Nacional de Ciencia y Tecnologia FONDECYT, under Grant No. 1110377, and the Fondo de Financiamiento de Centros de Investigacion en Areas Prioritarias FONDAP CIGIDEN, under Grant No. 15110017. The authors are grateful for this support. |
| This research has been supported by the International Copper Association (ICA), and the Chilean Fondo Nacional de Ciencia y Tecnología FONDECYT, under Grant No. 1110377 , and the Fondo de Financiamiento de Centros de Investigación en Áreas Prioritarias FONDAP CIGIDEN , under Grant No. 15110017 . The authors are grateful for this support. |