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| DOI | 10.1016/J.CONBUILDMAT.2016.03.146 | ||||
| Año | 2016 | ||||
| Tipo | artículo de investigación |
Citas Totales
Autores Afiliación Chile
Instituciones Chile
% Participación
Internacional
Autores
Afiliación Extranjera
Instituciones
Extranjeras
Bond strength between the infill materials and embedded components of composite structural assemblies (CSAs) significantly affects the performance of sandwich panels. This paper presents the effectiveness of the interlocking area and bearing area on bond behaviour of galvanized steel strips as embedded components and foamed concrete as infill material. In total 60 pull-out specimens with a density of 1200 kg/m(3) were tested under tensile load. The specimens were prepared in two batches with different strip thickness. Each batch consists of ten groups with the variations on number of holes, locking holes area, bearing area, radius of holes, holes patterns and strips thickness. The results indicate that an increase in locking area results in higher tensile capacity along with greater displacement at the initial stage of loading due to lower interfacial area between strips and foamed concrete. Based on the experimental results equations were developed to analytically describe the bond slip behaviour, tensile capacity and bond strength of embedded steel strips in foamed concrete. (C) 2016 Elsevier Ltd. All rights reserved.
| Ord. | Autor | Género | Institución - País |
|---|---|---|---|
| 1 | Sayadi, Ali A. | Hombre |
Auckland Univ Technol - Nueva Zelanda
Auckland University of Technology - Nueva Zelanda |
| 2 | VILCHES-TAPIA, JUAN | Hombre |
Universidad Católica del Maule - Chile
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| 3 | Neitzert, Thomas R. | Hombre |
Auckland Univ Technol - Nueva Zelanda
Auckland University of Technology - Nueva Zelanda |
| 4 | Clifton, G. Charles | - |
UNIV AUCKLAND - Nueva Zelanda
University of Auckland - Nueva Zelanda The University of Auckland - Nueva Zelanda |
| Fuente |
|---|
| Auckland University of Technology (AUT), New Zealand |
| New Zealand Ministry for Research, Science and Technology |
| Agradecimiento |
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| The authors would like to acknowledge the financial support of the New Zealand Ministry for Research, Science and Technology under contract number HERX0401. The support of the Auckland University of Technology (AUT), New Zealand, is also acknowledged. |
| The authors would like to acknowledge the financial support of the New Zealand Ministry for Research, Science and Technology under contract number HERX0401. The support of the Auckland University of Technology (AUT), New Zealand, is also acknowledged. |