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| Indexado |
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| DOI | 10.3390/E19110619 | ||||
| Año | 2017 | ||||
| Tipo | artículo de investigación |
Citas Totales
Autores Afiliación Chile
Instituciones Chile
% Participación
Internacional
Autores
Afiliación Extranjera
Instituciones
Extranjeras
Sandwich structures are very attractive due to their high strength at a minimum weight, and, therefore, there has been a rapid increase in their applications. Nevertheless, these structures may present imperfect bonding or debonding between the skins and core as a result of manufacturing defects or impact loads, degrading their mechanical properties. To improve both the safety and functionality of these systems, structural damage assessment methodologies can be implemented. This article presents a damage assessment algorithm to localize and quantify debonds in sandwich panels. The proposed algorithm uses damage indices derived from the modal strain energy method and a linear approximation with a maximum entropy algorithm. Full-field vibration measurements of the panels were acquired using a high-speed 3D digital image correlation (DIC) system. Since the number of damage indices per panel is too large to be used directly in a regression algorithm, reprocessing of the data using principal component analysis (PCA) and kernel PCA has been performed. The results demonstrate that the proposed methodology accurately identifies debonding in composite panels.
| Ord. | Autor | Género | Institución - País |
|---|---|---|---|
| 1 | MERUANE-NARANJO, VIVIANA | Mujer |
Universidad de Chile - Chile
|
| 2 | LASEN-ANDRADE, MATIAS ALEJANDRO | Hombre |
Universidad de Chile - Chile
|
| 3 | LOPEZ-DROGUETT, ENRIQUE ANDRES | Hombre |
Universidad de Chile - Chile
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| 4 | ORTIZ-MEJIAS, ANA MIREYA | Hombre |
Universidad de Chile - Chile
|
| Fuente |
|---|
| FONDEQUIP |
| Fondo Nacional de Desarrollo Científico y Tecnológico |
| Fondo Nacional de Desarrollo CientÃfico y Tecnológico |
| Chilean National Fund for Scientific and Technological Development (FONDECYT) |
| Chilean National Fund for Scientific and Technological Development |
| Agradecimiento |
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| The authors acknowledge the partial financial support of the Chilean National Fund for Scientific and Technological Development (FONDECYT) under Grant No. 1170535 and the FONDEQUIP Program under grant EQM130026. |
| Acknowledgments: The authors acknowledge the partial financial support of the Chilean National Fund for Scientific and Technological Development (FONDECYT) under Grant No. 1170535 and the FONDEQUIP Program under grant EQM130026. |