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| Indexado |
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| DOI | 10.59499/EP246280921 | ||
| Año | 2024 | ||
| Tipo |
Citas Totales
Autores Afiliación Chile
Instituciones Chile
% Participación
Internacional
Autores
Afiliación Extranjera
Instituciones
Extranjeras
Applications such as high-power contacts or nuclear fusion reactors frequently rely on W-Cu composites when demanding exceptional electrical and thermal conductivity under extreme conditions. Powder metallurgy serves to create this type of material with different melting points. However, there is a discussion in the literature about the most suitable powder metallurgy techniques. Spark Plasma Sintering (SPS) and Rapid Sintering Process (RSP) make it possible to produce materials within minutes and at lower temperatures on an industrial scale. This study undertakes a comparative analysis of two different sintering techniques at 600°C while varying the pressure and sintering time for W-Cu samples containing 25% and 75%wt. of W. Results show that it is possible to sinter composite W-Cu at 600°C. The material's density, hardness, and microstructure are significantly affected by sintering time. Furthermore, RSP tends to generate higher densities, hardness and Young's modulus.
| Ord. | Autor | Género | Institución - País |
|---|---|---|---|
| 1 | Sauceda, Sergio | Hombre |
Universidad de Concepción - Chile
Universidad de Sevilla - España |
| 2 | LASCANO-FARAK, SHEILA KATHERINE | Mujer |
Universidad Técnica Federico Santa María - Chile
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| 3 | Arevalo, Cristina | Mujer |
Universidad de Sevilla - España
|
| 4 | Montealegre, Isabel | - |
Universidad de Sevilla - España
|
| 5 | Pérez-Soriano, E. M. | - |
Universidad de Sevilla - España
|
| 6 | Pedrosa, P. | - |
Universidad de Sevilla - España
|
| 7 | Machuca, A. | - |
Universidad Técnica Federico Santa María - Chile
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| 8 | Chavez, R. | - |
Universidad Técnica Federico Santa María - Chile
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| 9 | Araya, Nicolas | Hombre |
Universidad de Concepción - Chile
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| Agradecimiento |
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| This work was supported by the Agencia Nacional de Investigaci\u00F3n y Desarrollo (ANID) of Chile government Scholarship Program/DOCTORADO/2021-21210700, Program/DOCTORADO/2021-21211274 and FONDEQUIP EQM170156. The company RHP-Scholarship Technology GmbH is grateful for allowing samples to be manufactured at the company's facilities. The authors want to thank the Universidad de Sevilla for the use of experimental facilitates at CITIUS (VII PPIT-2023-I.5 Cristina Ar\u00E9valo Mora). |