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Analysis of copper slag from a Chilean foundry for application as filler material in thermal energy storage systems
Indexado
WoS WOS:001400747900001
Scopus SCOPUS_ID:85214555582
DOI 10.1016/J.EST.2024.115281
Año 2025
Tipo artículo de investigación

Citas Totales

Autores Afiliación Chile

Instituciones Chile

% Participación
Internacional

Autores
Afiliación Extranjera

Instituciones
Extranjeras


Abstract



In the field of solar thermal storage systems, metallurgical industry by-products have been proposed as filler materials for packed-bed thermal energy storage due to their low cost and suitable thermophysical properties. One of these by-products is copper slag, which has emerged as a competitive option compared to other types of industrial by-products. However, further research of its properties, composition, and heterogeneity is needed to fully address its potential as a storage medium. Approximately 2.2 tons of copper slag is produced per ton of copper extracted, posing disposal challenges for mining companies. Hence, there is growing interest in finding secondary uses for these slags. The present study investigated samples of copper slag from a Chilean foundry disposal site. Elemental and mineral characterization revealed that this heterogeneous material has high iron content with both amorphous and crystalline phases present. The evaluation of thermophysical properties showed stable specific heat capacity that increases with temperature within the range of 100 °C to 450 °C. However, these profiles exhibit variability in heat capacity, particularly at higher temperatures, which decreases with subsequent heating cycles. The results suggest that copper slag has potential as an alternative material for sensible heat storage in packed-bed systems, nonetheless, assessing the variability of its thermophysical properties is crucial to establish its feasibility for sustainable energy solutions.

Revista



Revista ISSN
Journal Of Energy Storage 2352-152X

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Disciplinas de Investigación



WOS
Energy & Fuels
Scopus
Sin Disciplinas
SciELO
Sin Disciplinas

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Publicaciones WoS (Ediciones: ISSHP, ISTP, AHCI, SSCI, SCI), Scopus, SciELO Chile.

Colaboración Institucional



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Autores - Afiliación



Ord. Autor Género Institución - País
1 Segovia A., Valentina - Pontificia Universidad Católica de Chile - Chile
1 Segovia, A. Valentina - Pontificia Universidad Católica de Chile - Chile
2 CARDEMIL-IGLESIAS, JOSE MIGUEL Hombre Pontificia Universidad Católica de Chile - Chile
3 SANCY-VELASQUEZ, MAMIE ODETTE Mujer Pontificia Universidad Católica de Chile - Chile
4 ESCOBAR-HENRIQUEZ, RAUL GUILLERMO Hombre Pontificia Universidad Católica de Chile - Chile

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Financiamiento



Fuente
Universidad Tecnológica Metropolitana
Universidad Técnica Federico Santa María
SERC-Chile
ANID/FONDAP
ANID/FONDEF
Doctoral Scholarship ANID-BECAS/Doctorado Nacional

Muestra la fuente de financiamiento declarada en la publicación.

Agradecimientos



Agradecimiento
The authors appreciate the financial support from the project ANID/FONDEF/ID22I10200, "RadTES-CS/Radial Packed-Bed Thermal Storage System Using Copper Slag as Storage Medium", as well as the project ANID/FONDAP/1523A0006 "Solar Energy Research Center"-SERC-Chile. The authors are also grateful to UTEM (Universidad Tecnologica Metropolitana) for FE-SEM and EDS measurements and USM (Universidad Tecnica Federico Santa Maria) for XRD analyses. In addition, V. Segovia would like to thank the Doctoral Scholarship ANID-BECAS/Doctorado Nacional/21232013.
The authors appreciate the financial support from the project ANID/FONDEF/ID22I10200, \u201CRadTES-CS/Radial Packed-Bed Thermal Storage System Using Copper Slag as Storage Medium\u201D, as well as the project ANID/FONDAP/1523A0006 \u201CSolar Energy Research Center \u201D- SERC-Chile. The authors are also grateful to UTEM (Universidad Tecnol\u00F3gica Metropolitana) for FE-SEM and EDS measurements and USM (Universidad T\u00E9cnica Federico Santa Mar\u00EDa) for XRD analyses. In addition, V. Segovia would like to thank the Doctoral Scholarship ANID-BECAS/Doctorado Nacional/21232013.

Muestra la fuente de financiamiento declarada en la publicación.