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Ti3C2Tx-UHMWPE Nanocomposites—Towards an Enhanced Wear-Resistance of Biomedical Implants
Indexado
WoS WOS:001339841300001
Scopus SCOPUS_ID:85207499291
DOI 10.1002/JBM.A.37819
Año 2025
Tipo artículo de investigación

Citas Totales

Autores Afiliación Chile

Instituciones Chile

% Participación
Internacional

Autores
Afiliación Extranjera

Instituciones
Extranjeras


Abstract



There is an urgent need to enhance the mechanical and biotribological performance of polymeric materials utilized in biomedical devices such as load-bearing artificial joints, notably ultrahigh molecular weight polyethylene (UHMWPE). While two-dimensional (2D) materials like graphene, graphene oxide (GO), reduced GO, or hexagonal boron nitride (h-BN) have shown promise as reinforcement phases in polymer matrix composites (PMCs), the potential of MXenes, known for their chemical inertness, mechanical robustness, and wear-resistance, remains largely unexplored in biotribology. This study aims to address this gap by fabricating Ti3C2Tx-UHMWPE nanocomposites using compression molding. Primary objectives include enhancements in mechanical properties, biocompatibility, and biotribological performance, particularly in terms of friction and wear resistance in cobalt chromium alloy pin-on-UHMWPE disk experiments lubricated by artificial synovial fluid. Thereby, no substantial changes in the indentation hardness or the elastic modulus are observed, while the analysis of the resulting wettability and surface tension as well as indirect and direct in vitro evaluation do not point towards cytotoxicity. Most importantly, Ti3C2Tx-reinforced PMCs substantially reduce friction and wear by up to 19% and 44%, respectively, which was attributed to the formation of an easy-to-shear transfer film.

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Disciplinas de Investigación



WOS
Materials Science, Biomaterials
Engineering, Biomedical
Scopus
Biomedical Engineering
Biomaterials
Ceramics And Composites
Metals And Alloys
SciELO
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Publicaciones WoS (Ediciones: ISSHP, ISTP, AHCI, SSCI, SCI), Scopus, SciELO Chile.

Colaboración Institucional



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Autores - Afiliación



Ord. Autor Género Institución - País
1 Rothammer, Benedict Hombre Friedrich Alexander Univ Erlangen Nurnberg FAU - Alemania
Friedrich-Alexander-Universität Erlangen-Nürnberg - Alemania
2 Feile, Klara - Friedrich Alexander Univ Erlangen Nurnberg FAU - Alemania
Friedrich-Alexander-Universität Erlangen-Nürnberg - Alemania
3 Werner, Siegfried - Friedrich Alexander Univ Erlangen Nurnberg FAU - Alemania
Friedrich-Alexander-Universität Erlangen-Nürnberg - Alemania
4 Frank, Rainer - Friedrich Alexander Univ Erlangen Nurnberg FAU - Alemania
Friedrich-Alexander-Universität Erlangen-Nürnberg - Alemania
5 Bartz, Marcel Hombre Friedrich Alexander Univ Erlangen Nurnberg FAU - Alemania
Friedrich-Alexander-Universität Erlangen-Nürnberg - Alemania
6 Wartzack, Sandro Hombre Friedrich Alexander Univ Erlangen Nurnberg FAU - Alemania
Friedrich-Alexander-Universität Erlangen-Nürnberg - Alemania
7 Schubert, Dirk W. - Friedrich Alexander Univ Erlangen Nurnberg FAU - Alemania
Friedrich-Alexander-Universität Erlangen-Nürnberg - Alemania
8 Drummer, Dietmar - Friedrich Alexander Univ Erlangen Nurnberg FAU - Alemania
Friedrich-Alexander-Universität Erlangen-Nürnberg - Alemania
9 Detsch, Rainer Hombre Friedrich Alexander Univ Erlangen Nurnberg FAU - Alemania
Friedrich-Alexander-Universität Erlangen-Nürnberg - Alemania
10 Wang, Bo - Saarland Univ - Alemania
Universität des Saarlandes - Alemania
11 Rosenkranz, Andreas - Universidad de Chile - Chile
Millennium Nuclei Adv MXenes Sustainable Applicat - Chile
ANID – Millennium Science Initiative Program - Chile
12 Marian, Max - Pontificia Universidad Católica de Chile - Chile
Leibniz Univ Hannover - Alemania
Gottfried Wilhelm Leibniz Universität Hannover - Alemania

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Financiamiento



Fuente
FONDEQUIP
Fondo Nacional de Desarrollo Científico y Tecnológico
Friedrich-Alexander-Universitat Erlangen-Nurnberg
ANID-Chile
Millennium Science Initiative Program
ANID‐Chile
Schaeffler FAG Foundation
Vicerrectoria Academic y Prorectoria of Pontificia Universidad Catolica de Chile
Programa de Insercion Academica (PIA) 2022 Vicerrectoria Academic y Prorectoria of Pontificia Universidad Catolica de Chile

Muestra la fuente de financiamiento declarada en la publicación.

Agradecimientos



Agradecimiento
Max Marian greatly acknowledges the financial support from Programa de Insercion Academica (PIA) 2022 from the Vicerrectoria Academic y Prorectoria of Pontificia Universidad Catolica de Chile, the Schaeffler FAG Foundation within the Future Technology Award 2022, and ANID-Chile within project DFG220004. Andreas Rosenkranz gratefully acknowledges the financial support of ANID-Chile within the projects Fondecyt Regular 1220331 and Fondequip EQM190057 as well as and the Millennium Science Initiative Program (NCN2023_007).
Max Marian greatly acknowledges the financial support from Programa de Inserci\u00F3n Acad\u00E9mica (PIA) 2022 from the Vicerrector\u00EDa Acad\u00E9mic y Prorector\u00EDa of Pontificia Universidad Cat\u00F3lica de Chile, the Schaeffler FAG Foundation within the Future Technology Award 2022, and ANID\u2010Chile within project DFG220004. Andreas Rosenkranz gratefully acknowledges the financial support of ANID\u2010Chile within the projects Fondecyt Regular 1220331 and Fondequip EQM190057 as well as and the Millennium Science Initiative Program (NCN2023_007). Funding:
Max Marian greatly acknowledges the financial support from Programa de Inserci\u00F3n Acad\u00E9mica (PIA) 2022 from the Vicerrector\u00EDa Acad\u00E9mic y Prorector\u00EDa of Pontificia Universidad Cat\u00F3lica de Chile, the Schaeffler FAG Foundation within the Future Technology Award 2022, and ANID\u2010Chile within project DFG220004. Andreas Rosenkranz gratefully acknowledges the financial support of ANID\u2010Chile within the projects Fondecyt Regular 1220331 and Fondequip EQM190057 as well as and the Millennium Science Initiative Program (NCN2023_007). Funding:

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