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Novel design and thermal-dynamic analysis on impact-jet nested double-layer microchannel heat sinks with streaming block
Indexado
WoS WOS:001255523500001
Scopus SCOPUS_ID:85195164038
DOI 10.1016/J.APPLTHERMALENG.2024.123496
Año 2024
Tipo artículo de investigación

Citas Totales

Autores Afiliación Chile

Instituciones Chile

% Participación
Internacional

Autores
Afiliación Extranjera

Instituciones
Extranjeras


Abstract



In this study, a new design of impact-jet nested double-layer microchannel heat sinks with streaming block is described using 3D printing technologies for improving thermal performance. Both simulation and experiments show that the novel structure arrays improve the thermal characteristics when a streaming block is added to the channel compared with the ones without streaming blocks. The results of five 3D-printed test samples made by Selective Laser Melting method are confirmed by numerical simulations with laminar flow and experimental measurements. Under the same conditions, adding a streaming block to the lower channel significantly increases the thermal performance factor by 7 % on average. Heat transfer enhancement is very pronounced in both the streaming lower block and streaming upper block, as shown by the experimental research and numerical simulation. Additionally, among the five models, the impact-jet nested double-layer microchannel heat sinks with streaming upper block equaling 0.3 mm height shows the best overall thermal performance factor. In the case of Reynolds number equaling 580.4, the overall thermal performance factor of impact-jet nested double-layer microchannel heat sinks with streaming upper block equaling 0.3 mm height is 1.5807. The results indicate that the impact-jet nested double-layer microchannel heat sinks with streaming upper block equaling 0.3 mm height can achieve good heat dissipation with minimal pressure drop loss. The novelty of the work is to combine the advantages of double-layer microchannel, impact-jet nested structure and streaming block to enhance the overall thermal performance for extending the full lifecycle of micro electronic devices.

Revista



Revista ISSN
Applied Thermal Engineering 1359-4311

Métricas Externas



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Disciplinas de Investigación



WOS
Thermodynamics
Engineering, Mechanical
Mechanics
Energy & Fuels
Scopus
Industrial And Manufacturing Engineering
Energy Engineering And Power Technology
Mechanical Engineering
Fluid Flow And Transfer Processes
SciELO
Sin Disciplinas

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Publicaciones WoS (Ediciones: ISSHP, ISTP, AHCI, SSCI, SCI), Scopus, SciELO Chile.

Colaboración Institucional



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Autores - Afiliación



Ord. Autor Género Institución - País
1 Shen, Han - Xidian University - China
Xidian Univ - China
2 Li, Peng - Hubei University of Automotive Technology - China
Hubei Univ Automot Technol - China
3 Liu, Leixin - Xidian University - China
Xidian Univ - China
4 ROSALES-VERA, MARCO ANTONIO Hombre Universidad Tecnológica Metropolitana - Chile
5 Zheng, Shao Fei - North China Electric Power University - China
5 Zheng, Shao-Fei - North China Elect Power Univ - China

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Financiamiento



Fuente
National Natural Science Foundation of China
Youth Program of National Natural Science Foundation of China

Muestra la fuente de financiamiento declarada en la publicación.

Agradecimientos



Agradecimiento
The authors wish to thank the Youth Program of National Natural Science Foundation of China (52306111).
The authors wish to thank the Youth Program of National Natural Science Foundation of China (52306111) .

Muestra la fuente de financiamiento declarada en la publicación.