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| Indexado |
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| DOI | 10.1016/J.BUILDENV.2021.108373 | ||||
| Año | 2021 | ||||
| Tipo | artículo de investigación |
Citas Totales
Autores Afiliación Chile
Instituciones Chile
% Participación
Internacional
Autores
Afiliación Extranjera
Instituciones
Extranjeras
The inadequate use of passive thermal conditioning alternatives, such as phase change materials (PCM), in Chile, despite the climatological advantages in various regions of the country and the need to improve thermal comfort indexes in many houses and buildings, is mainly due to cultural and economic reasons. Passive thermal conditioning measures entail economic benefits and an improvement in the quality of life. However, it is perceived as a luxury and not as an investment by many Chileans. We propose an optimized implementation methodology for PCM using a house belonging to the National Housing Monitoring Network (ReNaM) in Santiago, Chile. The strategic use of PCM is based on thermal comfort and occupancy. The proposed methodology improves the thermal comfort indexes and reduces the thermal loads of the building, resulting in lower energy consumption and CO2 emission. The proposed methodology also considers economic aspects to promote PCM as a passive alternative for thermal conditioning.
| Ord. | Autor | Género | Institución - País |
|---|---|---|---|
| 1 | Bohórquez-Órdenes, Juan | Hombre |
Universidad de Santiago de Chile - Chile
|
| 2 | Tapia-Calderón, Andrés | Hombre |
Universidad de Santiago de Chile - Chile
|
| 3 | VASCO-CALLE, DIEGO ANDRES | Hombre |
Universidad de Santiago de Chile - Chile
|
| 4 | Estuardo-Flores, Oliver | Hombre |
Universidad de Santiago de Chile - Chile
|
| 5 | Haddad, Assed Naked | - |
Universidade Federal do Rio de Janeiro - Brasil
UNIV FED RIO DE JANEIRO - Brasil |
| Fuente |
|---|
| Universidad de Santiago de Chile |
| Proyecto FONDECYT |
| MINVU |
| ANID |
| Agencia Nacional de Investigación y Desarrollo |
| Departamento de Ingenieria Mecanica |
| Agencia Nacional de Investigacion y Desarrollo, ANID Chile |
| Agencia Nacional de Investigaci?n y Desarrollo |
| Departamento de Ingenieria Mecanica, Universidad de Santiago de Chile through Plan Operativo 2020 |
| Agradecimiento |
|---|
| The authors acknowledge the support of Proyecto Fondecyt 1201520, Agencia Nacional de Investigación y Desarrollo, ANID Chile, and MINVU by providing the necessary information. Andres Tapia acknowledges the Departamento de Ingeniería Mecánica, Universidad de Santiago de Chile , for their support through the funding of Plan Operativo 2020. |
| The authors acknowledge the support of Proyecto Fondecyt 1201520, Agencia Nacional de Investigación y Desarrollo, ANID Chile, and MINVU by providing the necessary information. Andres Tapia acknowledges the Departamento de Ingeniería Mecánica, Universidad de Santiago de Chile , for their support through the funding of Plan Operativo 2020. |
| The authors acknowledge the support of Proyecto Fondecyt 1201520, Agencia Nacional de Investigacion y Desarrollo, ANID Chile, and MINVU by providing the necessary information. Andres Tapia acknowledges the Departamento de Ingenieria Mecanica, Universidad de Santiago de Chile, for their support through the funding of Plan Operativo 2020. |