Muestra la distribución de disciplinas para esta publicación.
Publicaciones WoS (Ediciones: ISSHP, ISTP, AHCI, SSCI, SCI), Scopus, SciELO Chile.
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| Año | 2012 | ||
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Citas Totales
Autores Afiliación Chile
Instituciones Chile
% Participación
Internacional
Autores
Afiliación Extranjera
Instituciones
Extranjeras
The heat conduction across a collection of square modules forming a large plane wall is a one-dimensional problem, whereas the heat conduction across a collection of scalloped modules forming a large corrugated wall is a two-dimensional problem. In this work, the two dimensional heat conduction equation for three different scalloped modules derived from the square module is solved numerically with the Finite Element Method in the platform of COMSOL Multiphysics. When the temperature fields in the modules are post-processed, the conduction shape factors S to be used in the algebraic formula can be easily determined. The heat conductive increments provided by the derived scalloped modules are qualitatively compared with the square module, subsequently accounting for beneficial mass reductions.
| Ord. | Autor | Género | Institución - País |
|---|---|---|---|
| 1 | Campo, Antonio | Hombre |
University of Texas at San Antonio - Estados Unidos
The University of Texas at San Antonio - Estados Unidos |
| 2 | Celentano, Diego J. | Hombre |
Pontificia Universidad Católica de Chile - Chile
|
| 3 | Robbins, Justin E. | Hombre |
University of Vermont - Estados Unidos
|